Part Number 5050
Designed to seal small openings in new or existing raised floor cutouts used for communications or power cabling. Based on measurements at multiple data centers, on average 48% of valuable conditioned air is not reaching the air intake of IT equipment due to unsealed floor openings. This lost air, known as bypass airflow, contributes to IT equipment hot spots, cooling unit inefficiencies, and increasing infrastructure costs. KoldLok® products specifically address bypass airflow and its detrimental effects on data center cooling.
Features
Split frame
Interlocking feature that fastens the two halves together
Dry erase markable surface (non-permanent marker)
New and improved finish quality
Stronger material – better strength
Easier installation
Smooth polished surface
Benefits
Increased ability to remove and replace tiles with edge cuts
Reduced installation labor
Ability to custom label grid location or cabinet identification
Improved lifespan due to higher impact material
Quick removal under low height cabinets due to interlocking design
Easier to clean
